EngLee Tan currently serves as Lead Electronic Engineer at SICK Sensor Intelligence since February 2022, previously holding the position of Senior Electronic Engineer at the same company. Prior experience includes roles as Electrical Design Engineer at ResMed from July 2019 to January 2021, and Electrical and Electronic Engineer at EndoMaster Pte Ltd from August 2017 to July 2019. EngLee's career began as an R&D Electrical & Electronic Engineer at Ingenico Group from July 2013 to August 2017, where contributions included establishing the first R&D team in Singapore and leading cost-reduction initiatives for POS device BOM costs. Earlier, EngLee worked as an R&D Electrical Design Engineer at Sony, specializing in power supply systems, notably for high-capacity Mini Hi-Fi components. EngLee holds a Bachelor's Degree in Telecommunications Engineering from University Malaysia Perlis, completed in 2011.
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