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Kunmao Pan is a semiconductor engineer with over a decade of experience in silicon and compound semiconductor technologies. They began their career as a Device Integration Engineer at TSMC from 2010 to 2012, focusing on CMOS technologies and SPICE modeling. From 2012 to 2024, they served as a Senior Process Integration Engineer at Global Communication Semiconductors, Inc., where they managed process integration and development for various semiconductor devices. Currently, Kunmao is an Engineer Principal in Process Integration at TSMC, engaged in technology transfer and yield improvement. They hold a Master’s degree in Electrical Engineering from National Taiwan University and a Bachelor’s degree in Electrical Engineering from National Cheng Kung University.