Chong Ling Tan has a strong background in the field of packaging and assembly engineering. They began their career in 2005 as a Process Engineer for a company specializing in wire bond processes. During this role, they were successful in sustaining a wire bond yield of 99.80%.
In 2007, Chong Ling joined Statschippac Singapore as a Wirebond Process Engineer and was quickly promoted to Team Lead. In this position, they led a group of engineers and achieved an impressive assembly yield of 99.94%, improved OS LRR by 34%, and reduced the customer quality index from 4 cases to 2 cases per year.
After working at Statschippac Singapore for five years, Chong Ling moved to Semtech Corporation in 2012 as a Packaging and Assembly Engineer. In this role, they effectively managed assembly suppliers across multiple countries, including Malaysia, Taiwan, and the Philippines. Through their leadership, they were able to improve the overall assembly yield from 99% to an even higher percentage.
Most recently, in 2017, Chong Ling joined Power Integrations as a Staff Packaging and Assembly Engineer. In this position, they were the team leader for package engineering at the Penang Site, showcasing their ability to lead and manage a team.
Overall, Chong Ling Tan has demonstrated expertise in package engineering and assembly, with a track record of achieving high assembly yields, improving efficiency, and effectively managing suppliers and team members.
Chong Ling Tan obtained a Bachelor Degree in Engineering (Material Science) from the University Science Malaysia in the period from 2001 to 2005. Following this, from 2008 to 2011, Chong pursued a Master Degree in Business Administration at the University of Strathclyde.
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