Rajesh Kumar Dunaka is a dedicated Physical Design Engineer with over 6 years of specialized experience in VLSI, currently serving as a Senior Physical Design Engineer at Mirafra Technologies. Previously, they have held significant roles at Intel Corporation and leadIC Design Pvt Ltd, contributing to projects involving advanced semiconductor technology. Rajesh's expertise encompasses ASIC and SoC design, with a proven track record of successful tapeouts at Broadcom and other companies. Their technical proficiency includes a wide range of EDA tools, and they are committed to pushing the boundaries of chip design to achieve optimal results. Rajesh holds a BTech in Electronics and Communications Engineering from Gudlavalleru Engineering College and an advanced diploma in ASIC Design and Physical Design Engineering.
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Bengaluru, India
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