Brian Hirshman is a Senior Specialist Mechanical Engineer at L3Harris Technologies, where they have worked since 2025. With over 10 years of experience in electromechanical packaging design, Brian previously held roles at Spellman High Voltage Electronics Corporation as a Senior Mechanical Engineer and at KLD Labs, Inc. as a Mechanical Engineer. Brian earned a Bachelor of Science in Mechanical Engineering from Binghamton University in 2007 and is proficient in Autodesk Inventor 3D CAD software.
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