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Mogan Mahadevan is a Senior Package Failure Analysis Engineer at Intel Corporation, where they have performed package level failure analysis and worked on improving production yield and quality since 2017. Previously, Mogan served as a Production Engineer at Top Glove and completed a QA internship at Plexus Manufacturing Sdn Bhd in 2015. They hold multiple degrees, including a Master’s in Materials Engineering from Universiti Sains Malaysia, and an MBA in Engineering Management from Universiti Malaysia Perlis. Mogan is dedicated to making impactful changes in the semiconductor field.