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Ming-Che Lee is a SOC physical design engineer at Intel Corporation, bringing extensive expertise in digital circuits and systems. Previously, Ming-Che worked at AMD as a Physical Design Engineer, contributing to full-chip floorplanning, and at ViXS Systems Inc. as an Associate Engineer focusing on ASIC development. Ming-Che's research experience includes ultra-low power sequential logic design, with published patents and journal articles. Ming-Che holds a Master’s degree in Electrical and Electronics Engineering from McMaster University and a Bachelor's degree from National Chiao Tung University.