Umesh Painaik is an experienced engineer in the field of package development and signal integrity, currently serving as Lead Principal Package Development Engineer at Infineon Technologies since April 2022. Previously, Umesh held various roles at Cypress Semiconductor Corporation, including Sr. Manager of Package Development and Signal Integrity, and worked at Spansion, which is now part of Cypress, in multiple positions related to package development and signal integrity. Prior experience includes roles at Dell Technologies and Intel Corporation, where Umesh led signal integrity and packaging teams for application processors. Umesh's career began at Viewlogic Systems, Inc., with a trajectory that shows significant expertise in high-speed consulting and signal integrity engineering. Umesh holds a Master of Science degree in Electrical Engineering from Michigan Technological University and a Bachelor of Science in Electronics from the University of Mumbai.
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