Leong Thye Jien is a Package Silicon Integration Engineer currently employed at Micron Technology, where they serve as a roadmap pathfinder for silicon and package technologies across various market segments. With previous experience as a Senior Engineer at Infineon Technologies and a Graduate Research Fellow at Universiti Sains Malaysia, they have contributed to research on nanowires and chip-to-package interactions. Leong holds both a Bachelor’s degree in Manufacturing Engineering and a PhD in Manufacturing Engineering (Nanofabrication) from Universiti Teknologi Malaysia and Universiti Sains Malaysia, respectively. They are recognized for their commitment to quality output, collaboration across teams, and innovative methodologies in engineering processes.
Location
Malaysia
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