Jie Geng is an accomplished materials scientist with significant experience in research and development, particularly in thermal interface materials and high-reliability solder alloys. Currently serving as R&D Manager at Indium Corporation since December 2016, Jie leads the development of novel thermal interface materials and studies their compatibility with electronic packaging. Previous roles include Senior Research Metallurgist, where Jie developed Durafuse® HR solder paste, and Research Metallurgist, focusing on lead-free solder alloys for automotive and LED applications. Jie holds a PhD in Materials Science and Metallurgy from the University of Surrey, complemented by an M.Eng. from the Shanghai Institute of Ceramics and a B.Eng. from Huazhong University of Science and Technology. Early career experiences include research fellowships at Ames Laboratory and Brown University, where Jie contributed to the design and characterization of aluminum alloys and advanced alloy systems.
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