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Ryan Stacklin is a Senior Solutions Architect at HERE Technologies, specializing in architecting and deploying AWS environments for secure cloud applications while leading cost savings initiatives. Previously, Ryan served as a Business Intelligence Delivery Manager at Akoya, where expertise in data analysis and project administration was demonstrated. As a Senior Engineer at Carrier Corporation, Ryan improved production throughput by over 400% through quality and production technique implementation. A former Business Unit Manager at Breed Technologies, Ryan oversaw operations that produced over one million parts daily, managing a team of 190. Additional experience includes roles at Bliss Technologies and Yazaki North America in program management and production engineering. Ryan holds an MBA in finance and entrepreneurship from The University of Chicago Booth School of Business and a BS in Electrical Engineering from the University of Pittsburgh.