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Sadiq Mohiuddin is a Senior Principal Design Engineer at Broadcom Corporation, where they lead backend implementation and have successfully taped out Automotive and 10G+ Physical Layer Products since 2014. With over 25 years of chip design experience, Sadiq has a rich background in physical design convergence for high-speed and low-power ASICs. Prior to Broadcom, they worked at Intel Corporation, contributing to the design planning and physical implementation of multiple generations of the Intel Xeon Phi CPU, including projects that achieved notable rankings in energy efficiency and supercomputing. Sadiq holds a Master's degree in Electrical Engineering and an MBA, demonstrating a strong foundation in both technical and business aspects of engineering.